Press releases

Opening of SET USA Inc.

02/2023 - In February 2023, SET opened an American subsidiary, “SET USA Inc.”, based in Phoenix, Arizona.

SET launches the FC150 PLATINUM

11/2022 - As SEMICON Europa 2022 kicks off in Munich, Germany, SET officially launches its new Flip-Chip Bonder for advanced R&D.

SUCCESS STORY at Science and Technology Facilities Council (STFC)

02/2022 - The FC300 Flip-Chip Bonder at the Science and Technology Facilities Council (STFC), UK

SET subsidiary in China

01/2022 - On January 1st, 2022, SET opened its new subsidiary in China.

SET SUCCESS STORY at RWTH Aachen University, Germany

11/2021 - SET's ACCµRA100 Flip-Chip Bonder serving one of Germany’s largest technical universities.

Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration

09/2021 - SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers.

This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.


11/2020 - The ACCµRA100 Flip-Chip Bonder at the Technische Universität Ilmenau, Germany

Partnership launch between SET and TAIPRO ENGINEERING

08/2020 - Opening of a new flip-chip bonding demonstration center for Benelux

GOOGLE towards quantum supremacy with a machine from SET

10/2019 - 3 minutes 20 seconds.
That’s the record time announced by Google and the University of California, Santa Barbara (UCSB) to perform a calculation with a Sycamore quantum processor. A calculation that would have taken the most powerful computers 10,000 years.

SET with its FC150 Flip-Chip Bonder was part of this recent achievement.

SET launches the NEO HB – New product in the world of Flip-Chip Bonding

10/2019 - During the SEMICON trade show in Taiwan (September 2019) SET officially launched the NEO HB. The NEO HB is SET’s newest production Flip-Chip Bonder and was developed in partnership with the Nanoelec Technological Research Institute in Grenoble.