Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration09/2021 - SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers.
This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.
SET Success Story at the TECHNISCHE UNIVERSITÄT ILMENAU11/2020 - The ACCµRA100 Flip-Chip Bonder at the Technische Universität Ilmenau, Germany
Partnership launch between SET and TAIPRO ENGINEERING08/2020 - Opening of a new flip-chip bonding demonstration center for Benelux
GOOGLE towards quantum supremacy with a machine from SET10/2019 - 3 minutes 20 seconds.
That’s the record time announced by Google and the University of California, Santa Barbara (UCSB) to perform a calculation with a Sycamore quantum processor. A calculation that would have taken the most powerful computers 10,000 years.
SET with its FC150 Flip-Chip Bonder was part of this recent achievement.