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Quantum Computing
November 30th, 2017 Focus on bonding Download
Qubit compatible superconducting interconnects
Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype
June 30, 2016 Focus on bonding DPNC, University of Geneva, Switzerland Download
Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch
ECTC 2015 Focus on bonding IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Download
Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors
7-12 September, 2014 Focus on bonding UNIVERSITY OF SURREY, Guilford, Surrey, U.K. 10th International Conference on Position Sensitive Detectors Download
Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond
EPTC 2014 Focus on bonding IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Singapore Download
Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application
June 2014 Focus on bonding IME - Journal of Electronics materials (abstract) Download
Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications
June 2014 Focus on bonding RTI International Download
High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch
June 2014 Focus on bonding RTI International Download
Toward a Flip-Chip Bonder dedicated to Direct Bonding for Production Environment
IWLPC 2017 Focus on bonding Download
IWLPC October 24, 2017 SET, Saint-Jeoire, France
3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.
Chip to wafer copper direct bonding electrical characterization and thermal cycling
December 2013 Focus on bonding CEA – LETI, MINATEC Campus Download
Micro-tube insertion into aluminum pads: Simulation and experimental validations
IMAPS 2013 Focus on bonding CEA – LETI, MINATEC Campus Download
9th International Conference and Exhibition on Device Packaging
This material is posted here with permission of IMAPS.
Aluminum to aluminum Bonding at Room Temperature
ECTC 2013 Focus on bonding CEA – LETI, MINATEC Campus Download
Chip to wafer direct bonding technologies for high density 3D integration
ECTC 2012 Focus on bonding CEA – LETI, MINATEC, STMicroelectronics, SET Download
A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications
ECTC 2011 Focus on bonding CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M Download
This material is posted here with permission of IEEE.
Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly
ECTC 2011 Focus on bonding IBM T.J. Watson Research Center Download
This material is posted here with permission of IEEE.
Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration
ECTC 2010 Focus on bonding IMEC and the Katholieke Universiteit Leuven Download
This material is posted here with permission of IEEE.
Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process
ECTC 2010 Focus on bonding Institute of Microelectronics - A*STAR Download
This material is posted here with permission of IEEE.
Ultrathin 3D ACA FlipChip-In-Flex Technology
ECTC 2010 Focus on bonding Berlin Technical University, NB Technologies and Fraunhofer IZM Download
This material is posted here with permission of IEEE.
Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors
SPIE Defense, Sensing & Security 2010 Focus on bonding HRL Laboratories Download
Copyright 2010 SPIE
SET Technical Bulletin N°3
February 2010 Focus on bonding CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc... Download
Embedded active device packaging technology for real DDR2 memory chips
IWLPC 2010 Focus on bonding Industrial Technology Research Institute (ITRI) Download
Originally published in the IWLPC Proceedings
Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration
IMAPS 2010 Focus on bonding RTI International Download
This material is posted here with permission of Imaps.
Development done on Device Bonder to address 3D requirements in a Production Environment
Focus on bonding Download
IWLPC 2014 focus on bonding SET, Saint-Jeoire, France
Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes
Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections
Device Packaging 2009 Focus on bonding CEA-LETI Download
This material is posted here with permission of Imaps.
RF MEMS and flip-chip for space flight demonstrator
June 2009 Focus on bonding Thales Alenia Space Download
New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array
ECTC 2008 Focus on bonding CEA-LETI Download
This material is posted here with permission of IEEE.
NaPANIL “Library of Processes”
March 2012 Focus on nanoimprinting NaPANIL Download
Second edition with results of the NaPANIL-project
UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale
November 2008 Focus on nanoimprinting IISB Download
UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization
February 2008 Focus on nanoimprinting CNR-IMM Download
Die to wafer hybrid bonding equipment: throughput versus precision
MiNaPAD 2022 Conference proceeding SET, CEA Leti Download
Considerations on the design of high precision Flip-Chip Bonder for mass production
European 3D Summit 2016 Conference proceeding N. Raynaud Download
Towards 5μm Interconnection Pitch with Die-to-Wafer Direct Hybrid Bonding
ECTC 2021 Conference proceeding Download
Die-to-wafer direct hybrid bonding process is foreseen as a key enabler of heterogeneous 3D integration. Hybrid bonding technologies were first developed on W2W assembly reaching 3D interconnection pitch of 1μm . Recently, CEA-Leti demonstrated the feasibility of DTW direct hybrid bonding at 10μm with a specific die bonder (NEO HB) developed by SET Corporation. In this paper, the last improvements of DTW hybrid bonding process flow and die bonder alignment capability are presented. Main results showed an alignment capability improved to <1μm which enables bonding of die with <5μm interconnection pitch. Finally, multi-interconnection pitch bondings on a wafer were achieved with Cu pitches varying from 5μm to 10μm.
https://ieeexplore.ieee.org/document/9501509/authors#authors
Die-to-Wafer Direct Hybrid Bonding demonstration with High Alignment Accuracy and Electrical Yields
3DIC 2019 Conference proceeding Download
Opto-electronics flip-chip bonding automation and in-situ quality monitoring
Conference proceeding Download
Aurélien Griffart from SET at EMPC – Pisa, Italy, September 16-19, 2019
Die-to-Wafer Direct Bonding for Production Environment with a New Flip-Chip Bonder
MiNaPAD 2019 Conference proceeding Download
P. Metzger, N. Raynaud
MiNaPAD 2019
New Flip-Chip Bonder dedicated to Direct Bonding for Production Environment
ESTC 2018 Conference proceeding Download
Flip-chip assembly for focal plane array
Conference proceeding Download
Pascal Metzger from SET at IST :GST – Mumbai, India, November 25-26, 2017
Toward a flip-chip bonder dedicated to direct bonding for production environment
Conference proceeding Download
Pascal Metzger from SET at IWLPC – San Jose, CA, USA, October 24-25, 2017
Flip-chip bonding: how to meet the high accuracy requirements ?
Conference proceeding Download
Caroline Avrillier from SET at EMPC – Warsaw, Poland, September 10-13, 2017
High Accuracy Flip-Chip Equipement
Conference proceeding Download
Nicolas Raynaud from SET at European 3D Summit – Grenoble, France, 18-20 January 2016
Development done on Device Bonder to Address 3D Requirements in a Production Environment
Conference proceeding Download
Pascal Metzger from SET at IWLPC, San Jose, November 11-13, 2014
Flip-Chip Assembly FPA
Conference proceeding Download
Jean-Stéphane Mottet from SET at ORION – Moscow XXII International Conference Photoelectronics and Night Vision Devices, May 28th, 2014
Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die
Conference proceeding Download
Gilbert Lecarpentier from SET at Imaps Device Packaging 2012
Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme
Conference proceeding Download
Keith Cooper from SET North America at IWLPC 2011
Chip-to-Wafer Technologies for High Density 3D Integration
Conference proceeding Download
Penned by CEA Leti, Minatec campus, CNRS Cemes, ALES, SET, ST Microelectronics and presented at MinaPad 2011
3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction
Conference proceeding Download
Gilbert Lecarpentier from SET at Imaps Device Packaging 2011
Flip-chip die bonding: an enabling technology for 3D integration
Conference proceeding
Keith Cooper from SET North America at IWLPC 2010
Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding
Conference proceeding Download
Gilbert Lecarpentier from SET at Imaps Device Packaging 2010