Technical papers

Quantum Computing

November 30th, 2017 Focus on bonding Download

Qubit compatible superconducting interconnects

Toward a flip-chip bonder dedicated to direct bonding for production environment

Focus on bonding Download

IWLPC October 24, 2017    SET, Saint-Jeoire, France

3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.

Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype

June 30, 2016 Focus on bonding DPNC, University of Geneva, Switzerland Download

Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch

ECTC 2015 Focus on bonding IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Download

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

7-12 September, 2014 Focus on bonding UNIVERSITY OF SURREY, Guilford, Surrey, U.K. 10th International Conference on Position Sensitive Detectors Download

Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond

EPTC 2014 Focus on bonding IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Singapore Download

Development done on Device Bonder to address 3D requirements in a Production Environment

Focus on bonding Download

IWLPC 2014 focus on bonding SET, Saint-Jeoire, France

Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes

Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application

June 2014 Focus on bonding IME - Journal of Electronics materials (abstract) Download

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

June 2014 Focus on bonding RTI International Download

High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch

June 2014 Focus on bonding RTI International Download

Chip to wafer copper direct bonding electrical characterization and thermal cycling

December 2013 Focus on bonding CEA – LETI, MINATEC Campus Download

Micro-tube insertion into aluminum pads: Simulation and experimental validations

IMAPS 2013 Focus on bonding CEA – LETI, MINATEC Campus Download

9th International Conference and Exhibition on Device Packaging

This material is posted here with permission of IMAPS.

Aluminum to aluminum Bonding at Room Temperature

ECTC 2013 Focus on bonding CEA – LETI, MINATEC Campus Download

Chip to wafer direct bonding technologies for high density 3D integration

ECTC 2012 Focus on bonding CEA – LETI, MINATEC, STMicroelectronics, SET Download

A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications

ECTC 2011 Focus on bonding CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M Download

This material is posted here with permission of IEEE.

Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly

ECTC 2011 Focus on bonding IBM T.J. Watson Research Center Download

This material is posted here with permission of IEEE.

Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration

ECTC 2010 Focus on bonding IMEC and the Katholieke Universiteit Leuven Download

This material is posted here with permission of IEEE.

Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process

ECTC 2010 Focus on bonding Institute of Microelectronics - A*STAR Download

This material is posted here with permission of IEEE.

Ultrathin 3D ACA FlipChip-In-Flex Technology

ECTC 2010 Focus on bonding Berlin Technical University, NB Technologies and Fraunhofer IZM Download

This material is posted here with permission of IEEE.

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SPIE Defense, Sensing & Security 2010 Focus on bonding HRL Laboratories Download

Copyright 2010 SPIE

SET Technical Bulletin N°3

February 2010 Focus on bonding CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc... Download

Embedded active device packaging technology for real DDR2 memory chips

IWLPC 2010 Focus on bonding Industrial Technology Research Institute (ITRI) Download

Originally published in the IWLPC Proceedings

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

IMAPS 2010 Focus on bonding RTI International Download

This material is posted here with permission of Imaps.

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

Device Packaging 2009 Focus on bonding CEA-LETI Download

This material is posted here with permission of Imaps.

RF MEMS and flip-chip for space flight demonstrator

June 2009 Focus on bonding Thales Alenia Space Download

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array

ECTC 2008 Focus on bonding CEA-LETI Download

This material is posted here with permission of IEEE.

NaPANIL “Library of Processes”

March 2012 Focus on nanoimprinting NaPANIL Download

Second edition with results of the NaPANIL-project

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization

February 2008 Focus on nanoimprinting CNR-IMM Download

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

November 2008 Focus on nanoimprinting IISB Download

Towards 5μm interconnection pitch with Die-to-Wafer direct hybrid bonding

ECTC 2021 Conference proceeding

Die-to-wafer direct hybrid bonding process is foreseen as a key enabler of heterogeneous 3D integration. Hybrid bonding technologies were first developed on W2W assembly reaching 3D interconnection pitch of 1μm . Recently, CEA-Leti demonstrated the feasibility of DTW direct hybrid bonding at 10μm with a specific die bonder (NEO HB) developed by SET Corporation. In this paper, the last improvements of DTW hybrid bonding process flow and die bonder alignment capability are presented. Main results showed an alignment capability improved to <1μm which enables bonding of die with <5μm interconnection pitch. Finally, multi-interconnection pitch bondings on a wafer were achieved with Cu pitches varying from 5μm to 10μm.

https://ieeexplore.ieee.org/document/9501509/authors#authors

Toward a flip-chip bonder dedicated to direct bonding for production environment

Conference proceeding Download

Pascal Metzger from SET at IWLPC – San Jose, CA, USA, October 24-25, 2017  

Development done on Device Bonder to Address 3D Requirements in a Production Environment

Conference proceeding Download

Pascal Metzger from SET at IWLPC, San Jose, November 11-13, 2014

Opto-electronics flip-chip bonding automation and in-situ quality monitoring

Conference proceeding Download

Aurélien Griffart from SET at EMPC – Pisa, Italy, September 16-19, 2019  

Flip-chip bonding: how to meet the high accuracy requirements ?

Conference proceeding Download

Caroline Avrillier from SET at EMPC – Warsaw, Poland, September 10-13, 2017  

Flip-chip assembly for focal plane array

Conference proceeding Download

Pascal Metzger from SET at IST :GST – Mumbai, India, November 25-26, 2017  

High Accuracy Flip-Chip Equipement

Conference proceeding Download

Nicolas Raynaud from SET at European 3D Summit – Grenoble, France, 18-20 January 2016

Flip-Chip Assembly FPA

Conference proceeding Download

Jean-Stéphane Mottet from SET at ORION – Moscow XXII International Conference Photoelectronics and Night Vision Devices, May 28th, 2014

Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die

Conference proceeding Download

Gilbert Lecarpentier from SET at Imaps Device Packaging 2012

Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme

Conference proceeding Download

Keith Cooper from SET North America at IWLPC 2011

Chip-to-Wafer Technologies for High Density 3D Integration

Conference proceeding Download

Penned by CEA Leti, Minatec campus, CNRS Cemes, ALES, SET, ST Microelectronics and presented at MinaPad 2011

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

Conference proceeding Download

Gilbert Lecarpentier from SET at Imaps Device Packaging 2011

Flip-chip die bonding: an enabling technology for 3D integration

Conference proceeding

Keith Cooper from SET North America at IWLPC 2010

Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding

Conference proceeding Download

Gilbert Lecarpentier from SET at Imaps Device Packaging 2010