The LDP150 is an electrical press designed to bond large light or radiation detectors (50 ~ 150 mm).

The components are pressed together at room temperature, with accurate control of the force profile, preserving the initial high accuracy alignment and parallelism.

The LDP150 is able to apply pressure up to 100,000 N.

A predefined gap can be achieved between two components previously pre-bonded using a high accuracy Flip-Chip Bonder such as the FC150.


Key benefits

  • Preservation of the initial parallelism of the component stack
  • Bond join quality

Bonding processes

  • Room temperature compression
  • Optional thermo-compression
  • Parallelism and gap monitoring

Technical data

Click here to request the LDP150 datasheet.