SET LAUNCHES THE NEO HB – New Product in the World of Flip-Chip Bonding
Automated and Ultra-Precise
With a post-bonding accuracy of +/- 1 μm (3 sigmas) in stand-alone or fully automatic mode, SET’s latest flip-chip bonder is designed for production. Combining high precision, flexibility and short cycle time, the NEO HB is perfectly suited to hybrid or direct bonding (HB) processes.
The First in a New Line
The NEO HB, with its sleek design and its easy-to-use interface is the first of a new line of flip-chip bonders dedicated entirely to production. Three configurations are available: Chip-to-Chip, Chip-to-Wafer or Hybrid Bonding. Entirely driven by software and robotics, the NEO line offers a high production rate with an accuracy of +/- 1 μm, making production volumes highly profitable with a great return on investment. The NEO follows SET’s other lines, ACCµRA and FC.
Solution for a Growing Market
“The total die attach equipment market is expected to grow by 6% CAGR between 2019 and 2024, to reach ~$1.3B at the end of the period”, asserts Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea.
And he adds: “Highest growth application area will be stacked memory bonder market followed by optoelectronics and high end logic. To support ultra-fine pitch (<20um) and high-density interconnects of these applications, advanced tools are required: high accuracy (<3um) & high speed (>5K), multi-mode operation, advanced inspection capabilities, wider process window, large die sizes handling capability, broader application range.”
Under this dynamic context, newly released NEO HB advanced Flip-Chip Bonder is a smart tool, proposed by SET after several years of development, to support the current market demand and its challenging specifications.