Based in France, we are a world leading supplier of flip-chip bonders excelling in high-end, demanding applications.

Since 1975, we have accompanied laboratories and industries, which look for a high precision and an important reliability in the assembly of their components. We accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

With flip-chip bonders installed worldwide, we are globally renowned for the high post-bond sub-micron accuracy and the high flexibility of our equipment.

Ranging from manual loading version to fully automated version, our systems cover a wide range of applications and offer the unique ability to handle both fragile and small components onto substrates and wafers up to 300 mm.