MEMS / MOEMS Packaging
The ability to integrate mechanical elements with supporting electronics on a micro scale has bolstered Micro ElectroMechanical Systems (MEMS), Micro OptoElectroMechanical Systems (MOEMS), as an enabling technology, which has sparked interest in an impressive range of applications.
Sub-components can be constructed independently by using a combination of traditional processes and novel technologies. This scheme, however, presents a number of challenges for handling, maneuvering, aligning and attaching each component.
SET Flip-Chip Bonders demonstrate superior ability to handle delicate pieces (down to 200 microns) and to align them better than ± 1 µm, for example adaptive optics system or high end inkjet printer head.