en
fr
de
zh
FC150 PLATINUM
The FC150 PLATINUM is a versatile Flip-Chip Bonder suited to advanced R&D and pilot lines.
The FC150 PLATINUM is a versatile Flip-Chip Bonder dedicated to advanced R&D and pilot lines.
The FC150 PLATINUM is a versatile Flip-Chip Bonder dedicated to advanced R&D and pilot lines.
fc150
Key benefits
- ± 0.7 μm post-bond accuracy
- High-magnification microscope for sharp component images
- Easy to use, quick setup of new applications
- Control of parallelism to guarantee very high accuracy even under high forces
- Manual (step-by-step) and automatic mode
- Process recording for development / log files to track production
Process capabilities
- Flip-Chip / Die bonding
- Thermocompression
- Thermosonic
- Reflow
- UV / Thermal curing adhesives, polymers
Applications
- Chip-to-Chip
- Chip-to-Wafer
- Optoelectronics
- Silicon photonics
- Focal plane arrays
- Infrared and X-Ray image sensors
- 3D integration, memory stacking
- Nanoimprinting
Technical data
Click here to request the FC150 PLATINUM datasheet.