The FC150 PLATINUM is a versatile Flip-Chip Bonder dedicated to advanced R&D and pilot Lines.


Key benefits

  • ± 0.7 μm post-bond accuracy
  • High magnification microscope for a sharp image of the components
  • Easy to use, quick set-up of new applications
  • Control of parallelism to guarantee very high accuracy even under high forces
  • Manual (step by step) and automatic mode
  • Process recording for development, log files to track production

Process capabilities

  • Flip-Chip / Die bonding
  • Thermocompression
  • Thermosonic
  • Reflow
  • UV / Thermal curing adhesives, polymers


Technical data

Click here to request the FC150 PLATINUM datasheet.