The FC150 Flip-Chip Bonder permits to reach ± 1 µm post-bond accuracy.

Ranging from manual to full automation, it provides development and production capabilities on a single upgradable cost-effective platform.

Its high flexibility makes it perfect for advanced research, with the ability to move directly into pilot production.

The FC150 supports a complete range of bonding applications, including reflow, thermo-compression, thermosonic, adhesives and fusion bonding.

Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.