The FC150 Flip-Chip Bonder permits to reach ± 1 µm post-bond accuracy.

Ranging from manual to full automation, it provides development and production capabilities on a single upgradable cost-effective platform.

Its high flexibility makes it perfect for advanced research, with the ability to move directly into pilot production.

The FC150 supports a complete range of bonding applications, including reflow, thermo-compression, thermosonic, adhesives and fusion bonding.

Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.


Key benefits

  • ± 1 µm post-bond accuracy
  • Large range of bonding forces
  • Perfect parallelism control
  • Confining gas including formic acid
  • Unique vision system
  • Flexibility for research
  • Automatization for pilot line

Process capabilities

  • Flip-Chip / Die bonding
  • Thermocompression
  • Reflow
  • Adhesive bonding
  • Thermosonic

Technical data

Click here to request the FC150 datasheet.