High Pressure Bonding

High Precision and Pressure Bonding
For some particular devices, for example those very large and containing several millions of connections like bumps, very high pressure is required to achieve a good, reliable and efficient electrical and mechanical connection.
A two-steps assembly process is necessary.

A first bonding, just after achieving a precise alignment between substrate and chip, is done at high force on a Flip-Chip Bonder, for example 4000 N on a FC300.
To perform the second step, the assembled components are transferred to another equipment, a press. They are installed and secured on a chuck. Without losing the initial post-bond accuracy and parallelism, the bonding process is continued at room temperature and at very high pressure, according to a specific cycle. Forces as high as 100 000 N are available.