High Force Bonding
A first bonding, just after achieving a precise alignment between substrate and chip, is done at high force on a Flip-Chip Bonder.
Then, the assembled components are transferred to the LDP150. They are installed and secured on a chuck. Without losing the initial post-bond accuracy and parallelism, the bonding process is continued at room temperature and at very high force, according to specific cycles. Forces as high as 100 000 N are available.