Photonics Packaging

One of the main challenges in the assembly of optoelectronic devices (laser diode, optical bench, optical fiber, micro bench, HDD/HAMR, laser bars, µLEDs…) lies in the alignment and post-bonding accuracy.

In the field of high-speed and telecommunications fiber optic networks, the quality of the transmission signal is a critical factor in product performance. When aligning the laser to the optic fiber core, any differentiation greater than 1 µm results in unacceptable signal loss.

A submicronic post-bond accuracy coupled with real-time control of low force is a real asset to achieve this high demanding optical packaging.