Press releases

SET receives strategic wafer level packaging equipment order from SEMATECH at UAlbany NanoCollege

09/2010 - SEMATECH Will Perform Innovative 3D Applications at CNSE’s Albany NanoTech with SET’s High Accuracy FC300 System.

SET to collaborate with IMEC on 3D integration research

01/2009 - A Joint Development Program Will Employ S.E.T.'s High Accuracy FC300 System to Explore Advanced 3D Applications.

SET receives the Georg-Waeber-Prize for Innovation 2008

10/2008 - SET Received the Georg-Waeber-Prize for Innovation 2008

Cambridge University selects S.E.T. KADETT for LCoS applications

04/2008 - Cambridge University chooses SET system for its new project

The partnership between CEA-Leti and S.E.T. bears fruit: the FC300, a new high force device bonder with nanoimprint capabilities

11/2007 - SET introduces the Submicron FC300 for wafer diameters up to 300 mm.