With ± 1 µm post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production.
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- Closed-loop systems to guarantee a high repeatability in operations
- Ultra-high cleanliness – ISO 3
- Very short cycle time
- Compatible from stand alone to full automatic
- User-friendly interface for multiple applications and processes
- Hybrid / direct bonding
- Room temperature, low bonding force
- Metal-to-metal or oxide-to-oxide
- Flip-chip bonding, die bonding
- Chip-to-Wafer, wafer level applications
- Chip-to-substrate bonding
- Pick & Place
- Memory stacking
- 3D IC