With ± 0.5 µm (3 sigma) post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic Flip-Chip Bonder designed for production.

Key Benefits

  • Closed-loop systems to guarantee a high repeatability in operations
  • Ultra-high cleanliness – ISO 3
  • Very short cycle time
  • Compatible from stand alone to full automatic
  • User-friendly interface for multiple applications and processes


  • Hybrid / direct bonding
  • Room temperature, low bonding force
  • Metal-to-metal or oxide-to-oxide
  • Flip-chip bonding, die bonding
  • Chip-to-Wafer, wafer level applications
  • Chip-to-substrate bonding
  • Pick & Place
  • Memory stacking
  • 3D IC

Technical Data

Click here to request the NEO HB Datasheet.