With ± 1 µm post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production.

Combining high precision, flexibility and very short cycle time, it is perfectly suitable for hybrid / direct bonding processes (metal-to-metal or oxide-to-oxide), at room temperature and at low bonding force.


Click here to request the NEO HB Datasheet.


Key Benefits

  Closed-loop systems to guarantee a high repeatability in operations

  Ultra-high cleanliness – ISO 3

  Compatible from stand alone to full automatic

  User-friendly interface for multiple applications and processes

Technical Data

Click here to request the NEO HB Datasheet.


  Hybrid / direct bonding (room temperature)

  Flip-chip bonding, die bonding

  Chip-to-wafer, wafer level applications

  Chip-to-substrate bonding

  Pick & Place

Memory stacking