With ± 1 µm post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production.
Combining high precision, flexibility and very short cycle time, it is pefectly suitable for hybrid / direct bonding processes (metal-to-metal or oxide-to-oxide), at room temperature and at low bonding force.
Closed-loop systems to guarantee a high repeatability in operations
Ultra-high cleanliness – ISO 3
Compatible from stand alone to full automatic
User-friendly interface for multiple applications and processes
Click here to request the NEO HB Datasheet.
Hybrid / direct bonding (room temperature)
Flip-chip bonding, die bonding
Chip-to-wafer, wafer level applications
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