A broad product portfolio for a wide variety of applications

Since the delivery of the first Flip-Chip Bonder in 1981, SET has continuously improved its expertise in high accuracy alignment, placement and bonding.
Low or high force assembly, room or high temperature bonding, thermal or UV gluing, small or large, thin or thick components hybridization can be achieved on SET Flip-Chip Bonders, reaching submicron post-bond accuracy with a real time control of the process parameters.