The FC300 Flip-Chip Bonder is the newest generation of high accuracy and high force system for Chip-to-Chip -up to 100 mm- and Chip-to-Wafer -up to 300 mm- applications with ± 0.3 µm post-bond accuracy.

The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.

The leveling between both components is adjusted before each bonding within 1 μradian.

The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.