The FC300 Flip-Chip Bonder is the newest generation of high accuracy and high force system for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications with ± 0.3 µm post-bonding accuracy.

The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.

The leveling between both components is adjusted before each bonding within 1 μradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.