The FC300 Flip-Chip Bonder is the newest generation of high accuracy and high force system for Chip-to-Chip -up to 100 mm- and Chip-to-Wafer -up to 300 mm- applications with ± 0.3 µm post-bond accuracy.

The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.

The leveling between both components is adjusted before each bonding within 1 μradian.

The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.


Key benefits

  • ± 0.3 µm post-bond accuracy
  • Low / High bonding forces
  • Perfect parallelism control
  • Confining gas including formic acid
  • Unique vision system
  • From R&D to pilot line

Process capabilities

  • Flip-Chip / Die bonding
  • Thermocompression
  • Reflow
  • Adhesive bonding
  • UV-curing bonding
  • Thermosonic


Technical data

Click here to request the FC300 datasheet.