The FC300 Flip-Chip Bonder is the newest generation of high accuracy and high force system for Chip-to-Chip -up to 100 mm- and Chip-to-Wafer -up to 300 mm- applications with ± 0.3 µm post-bond accuracy.
The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.
The leveling between both components is adjusted before each bonding within 1 μradian.
The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.
- ± 0.3 µm post-bond accuracy
- Low / High bonding forces
- Perfect parallelism control
- Confining gas including formic acid
- Unique vision system
- From R&D to pilot line
- Flip-Chip / Die bonding
- Adhesive bonding
- UV-curing bonding
Click here to request the FC300 datasheet.