The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrate. It features also Nanoimprinting Lithography (NIL) capabilities.

With a quick process head reconfiguration, the FC300 platform performs multiple applications including:

 High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process;

 Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;

 UV-Curing for Adhesive Bonding or for Nanoimprinting using a UV-NIL process.

Click here to request the FC300 Datasheet.

Key Benefits

  ± 0.5 µm post-bonding accuracy and 20 µradians leveling guarantee highest quality for the most advanced products

  Semi-Open Confinement Chamber for Oxide Reduction (option)

  Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies

  NIL configuration as add-on to bonding capability for maximum flexibility

  Air bearing construction on a granite structure ensures long-term stability and reliability

  Optional integrated chamber for gang reflow in a gas or vacuum environment

Process Capabilities

  Die Bonding (Face Up)

  Flip Chip Bonding (Face to Face)

  Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding

  Thermocompression Bonding, Ultrasonic Bonding

  UV-Curing Bonding, Adhesive Bonding

  UV-NIL, Hot Embossing Lithography


  Chip-to-Chip, Chip-to-Wafer Bonding

  3D Interconnect, Chip Stacking, Heterogeneous Integration

  Optoelectronicss and Photonic Device Assembly


  Nanoimprint Applications: Optics, Microfluidics, etc…