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SET launches the NEO HB – New product in the world of Flip-Chip Bonding
10/2019 - During the SEMICON trade show in Taiwan (September 2019) SET officially launched the NEO HB. The NEO HB is SET’s newest production Flip-Chip Bonder and was developed in partnership with the Nanoelec Technological Research Institute in Grenoble.InnoWards 2018: SET winner of InnoManagement prize
At the 3rd annual InnoWards in Annecy, France, SET was awarded the InnoManagement Prize. This was in recognition of SET’s strong teamwork.SET second most successful company of Haute-Savoie
12/2017 – SET is classified the second most successful company of Haute-Savoie by the French newspaper Le Dauphiné Libéré.SET in the Forum of the FIT 2017
11/2017 – SET participates in the Forum of the FIT on 2017 in Paris.French National Bank for Investment, has labeled SET “BPI Excellence”
03/2017 – SET is again labeled BPI Excellence.SET winner of the MICRON D’OR (‘GOLDEN MICRON’)
09/2016 - SET is proud to announce it received a “Micron d’Or” (Golden Micron) at Micronora Fair end of September 2016, in Besançon, FranceSET is proud to announce a new and important partnership!
01/2016 - SET is proud to announce a new and important partnership, joining French consortium IRT Nanoelec based in Grenoble and headed by CEA-Leti.For more details, please refer to the Press release.