SET is proud to announce a new and important partnership!
01/2016 - SET is proud to announce a new and important partnership, joining French consortium IRT Nanoelec based in Grenoble and headed by CEA-Leti.
For more details, please refer to the Press release.
06/2013 – SET joined Minalogic.
Chip-to-Wafer Direct Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder
02/2011 - CEA Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES on Advanced Chip-to-Wafer Technologies for 3D Integration.
SET Introduces FC300R High Accuracy Device Bonder with Robotics
07/2011 - FC300R: an Easy-to-Use Production Platform Ideal for High Accuracy C2W Bonding, Die Attach, Flip-Chip and 3D Integration with TSV.
SET introduces Innovative Patented Chamber for Removal of Oxide
10/2010 - SET's Latest Developments in Oxide Removal
SET receives strategic wafer level packaging equipment order from SEMATECH at UAlbany NanoCollege
09/2010 - SEMATECH Will Perform Innovative 3D Applications at CNSE’s Albany NanoTech with SET’s High Accuracy FC300 System.
SET to collaborate with IMEC on 3D integration research
01/2009 - A Joint Development Program Will Employ S.E.T.'s High Accuracy FC300 System to Explore Advanced 3D Applications.
SET receives the Georg-Waeber-Prize for Innovation 2008
10/2008 - SET Received the Georg-Waeber-Prize for Innovation 2008
Cambridge University selects S.E.T. KADETT for LCoS applications
04/2008 - Cambridge University chooses SET system for its new project
The partnership between CEA-Leti and S.E.T. bears fruit: the FC300, a new high force device bonder with nanoimprint capabilities
11/2007 - SET introduces the Submicron FC300 for wafer diameters up to 300 mm.