Ontos CLEAN - Atmospheric-plasma surface treatment

ONTOS CLEAN is a semiautomated system for surface preparation. It uses a patented atmospheric plasma with a unique design that enables oxidizing or reducing chemistry without any modification.

ONTOS CLEAN performs cleaning, eliminates organic contamination, activates surfaces, and removes oxidation.

An innovative process applies a gaseous passivation that delays the reoxidation of metallic surfaces.

Key benefits

• Removes native oxide from metallic and semiconductor surfaces
• Engineered surface-termination inhibits reoxidation
• Removes residual organic contamination films
• Fast, non-toxic, dry atmospheric process
• Low-energy surface chemistry – CMOS-safe
• Ideal surface preparation for direct bonding
• Compact configuration
• Automation-compatible

Technical data

Click here to request the Ontos CLEAN datasheet.

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Ontos IS - Atmospheric plasma-head for integration into third-party equipment

The ONTOS plasma head is available for integration into third-party equipment.
Three head sizes are available: 10 mm, 25 mm, and 40 mm.

The ONTOS IS system is available on the FC300 Flip-Chip Bonder.

Key benefits

• Downstream radical chemistry only
• CMOS- and detector-safe
• Fast process, continuous-throughput capable
• Non-toxic, dry process – OSHA- and EPA-friendly

Applications

• Surface preparation for bonding
• Photoresist residue removal
• Photomask cleaning
• Native oxide removal from semiconductor surfaces
• Organic contamination removal prior to adhesive bonding
• Pre-plating surface preparation

Technical data

Click here to request the Ontos IS datasheet.