The OntosTT, proposed in 2 versions – 200 mm and 300 mm , is a table-top semi-automatic Atmospheric Plasma System for surface preparation.
2 sizes of Plasma head are available – 25 mm and 40 mm.
It provides a simple, effective, clean surface modification method which does not require the throughput-robbing vacuum chamber associated with traditional plasma systems.
It performs this surface modification without ion bombardment and without the cross-contamination issues often associated with conventional plasma systems.
The OEM version of the Ontos Plasma Head is available for integration into third party equipment.
3 sizes of Plasma head are available – 10 mm, 25 mm and 40 mm.
The OntosIS system is available on our FC300 Flip-Chip Bonder.
Click here to request the OntosTT Datasheet.
Surface preparation for bonding
Photoresist residue removal
Native oxide removal from semiconductor surfaces
Organic contamination removal prior to adhesive bonding
Pre-plating surface preparation