OntosTT - Stand alone atmospheric plasma system

The OntosTT, proposed in 2 versions – 200 mm and 300 mm , is a table-top semi-automatic atmospheric plasma system for surface preparation.

2 sizes of plasma head are available – 25 mm and 40 mm.

It provides a simple, effective, clean surface modification method which does not require the throughput-robbing vacuum chamber associated with traditional plasma systems.

It performs this surface modification without ion bombardment and without the cross-contamination issues often associated with conventional plasma systems.


OntosIS (OEM) - Atmospheric plasma head for integration into third party equipment

The OEM version of the ONTOS plasma head is available for integration into third party equipment.
3 sizes of plasma head are available – 10 mm, 25 mm and 40 mm.

The OntosIS system is available on the FC300 Flip-Chip Bonder.



Key benefits

  • Downstream radical chemistry only
  • CMOS safe, detector safe
  • Fast process – continuous throughput capable
  • Non-toxic, dry process. OSHA and EPA-friendly


  • Surface preparation for bonding
  • Photoresist residue removal
  • Photomask cleaning
  • Native oxide removal from semiconductor surfaces
  • Organic contamination removal prior to adhesive bonding
  • Pre-plating surface preparation

Technical data

Click here to request the OntosTT-OntosIS datasheet.