Technical papers

Flip-Chip Assembly for Focal Plane Array

Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme

Chip-to-Wafer Technologies for High Density 3D Integration

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

RF MEMS and flip-chip for space flight demonstrator

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array