Technical papers

Quantum Computing

Toward a flip-chip bonder dedicated to direct bonding for production environment

Toward a flip-chip bonder dedicated to direct bonding for production environment

Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype

Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

Development done on Device Bonder to address 3D requirements in a Production Environment

Development done on Device Bonder to Address 3D Requirements in a Production Environment

Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications