Technical papers

Opto-electronics flip-chip bonding automation and in-situ quality monitoring

Quantum Computing

Flip-chip bonding: how to meet the high accuracy requirements ?

NPS300 Nano imPrinting Stepper

Micro-tube insertion into aluminum pads: Simulation and experimental validations

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization