Technical papers

Towards 5μm interconnection pitch with Die-to-Wafer direct hybrid bonding

Quantum Computing

Toward a flip-chip bonder dedicated to direct bonding for production environment

Toward a flip-chip bonder dedicated to direct bonding for production environment

Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype

Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond

Development done on Device Bonder to address 3D requirements in a Production Environment

Development done on Device Bonder to Address 3D Requirements in a Production Environment