Technical papers

Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process

Ultrathin 3D ACA FlipChip-In-Flex Technology

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SET Technical Bulletin N°3

Embedded active device packaging technology for real DDR2 memory chips

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding

Flip-chip die bonding: an enabling technology for 3D integration

Development done on Device Bonder to Address 3D Requirements in a Production Environment

Development done on Device Bonder to address 3D requirements in a Production Environment