Technical papers

Chip to wafer copper direct bonding electrical characterization and thermal cycling

Micro-tube insertion into aluminum pads: Simulation and experimental validations

Aluminum to aluminum Bonding at Room Temperature

Chip to wafer direct bonding technologies for high density 3D integration

A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications

NaPANIL “Library of Processes”

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization

Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly

Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration