NEO HB

NEO HB是一款專為大量生產而設計的全自動覆晶接合機, 不論是在單機或全自動化運行模式, 皆可達到± 1 µm (3 sigmas)接合完成精度。

結合了高接合精度、高生產靈活性和縮短生產週期三項優勢,NEO HB專門為混合式/直接接合製程所設計。

点击这里获得NEO HB的产品资料

 

Key Benefits

  Closed-loop systems to guarantee a high repeatability in operations

  Ultra-high cleanliness – ISO 3

  Compatible from stand alone to full automatic

  User-friendly interface for multiple applications and processes

Technical Data

Click here to request the NEO HB Datasheet.

Applications

  Hybrid / direct bonding (room temperature)

  Flip-chip bonding, die bonding

  Chip-to-wafer, wafer level applications

  Chip-to-substrate bonding

  Pick & Place

Memory stacking

3D IC