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NEO HB
NEO HB是一款專為大量生產而設計的全自動覆晶接合機, 不論是在單機或全自動化運行模式, 皆可達到± 1 µm (3 sigmas)的接合完成精度。
結合了高接合精度、高生產靈活性和縮短生產週期三項優勢，NEO HB專門為混合式/直接接合製程所設計。
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Key Benefits
Closed-loop systems to guarantee a high repeatability in operations
Ultra-high cleanliness – ISO 3
Compatible from stand alone to full automatic
User-friendly interface for multiple applications and processes
Applications
Hybrid / direct bonding (room temperature)
Flip-chip bonding, die bonding
Chip-to-wafer, wafer level applications
Chip-to-substrate bonding
Pick & Place
Memory stacking
3D IC