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NEO HB
The NEO HB is an automatic Flip-Chip Bonder designed for ± 0.5 µm @ 3 σ post-bond accuracy in stand-alone or fully automatic mode.
Suitable for hybrid / direct bonding processes.
The NEO HB combines high precision, flexibility, and short cycle-time.
Dedicated to production.
NEO HB
Key benefits
- ± 0.5 µm @ 3 σ post-bond accuracy
- Fully automatic functions
- User-friendly interface
- High repeatability thanks to closed-loop systems
- Compatible from stand-alone to fully automatic
- Cleanliness level: ISO 5 stand-alone / ISO 3 fully automatic
Processes
- Hybrid / direct bonding at room temperature
- Flip-chip bonding, die bonding
Applications
- Chip-to-Wafer, wafer level applications
- Chip-to-Substrate
- Pick & Place
Markets
- Telecommunications, 5G, 6G
- Memory stacking
- 3D IC
- HPC
- AI
