Articles Techniques

Quantum Computing

November 30th, 2017 Focus sur le soudage Télécharger

Qubit compatible superconducting interconnects

Toward a flip-chip bonder dedicated to direct bonding for production environment

Focus sur le soudage Télécharger

IWLPC October 24, 2017    SET, Saint-Jeoire, France

3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.

Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype

June 30, 2016 Focus sur le soudage DPNC, University of Geneva, Switzerland Télécharger

Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch

ECTC 2015 Focus sur le soudage IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Télécharger

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

7-12 September, 2014 Focus sur le soudage UNIVERSITY OF SURREY, Guilford, Surrey, U.K. 10th International Conference on Position Sensitive Detectors Télécharger

Development done on Device Bonder to address 3D requirements in a Production Environment

Focus sur le soudage Télécharger

IWLPC 2014 focus on bonding SET, Saint-Jeoire, France

Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes

Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application

June 2014 Focus sur le soudage IME - Journal of Electronics materials (abstract) Télécharger

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

June 2014 Focus sur le soudage RTI International Télécharger

High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch

June 2014 Focus sur le soudage RTI International Télécharger

Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond

EPTC 2014 Focus sur le soudage IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Singapore Télécharger

Chip to wafer copper direct bonding electrical characterization and thermal cycling

December 2013 Focus sur le soudage CEA – LETI, MINATEC Campus Télécharger

Micro-tube insertion into aluminum pads: Simulation and experimental validations

IMAPS 2013 Focus sur le soudage CEA – LETI, MINATEC Campus Télécharger

9th International Conference and Exhibition on Device Packaging

This material is posted here with permission of IMAPS.

Aluminum to aluminum Bonding at Room Temperature

ECTC 2013 Focus sur le soudage CEA – LETI, MINATEC Campus Télécharger

Chip to wafer direct bonding technologies for high density 3D integration

ECTC 2012 Focus sur le soudage CEA – LETI, MINATEC, STMicroelectronics, SET Télécharger

A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications

ECTC 2011 Focus sur le soudage CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M Télécharger

This material is posted here with permission of IEEE.

Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly

ECTC 2011 Focus sur le soudage IBM T.J. Watson Research Center Télécharger

This material is posted here with permission of IEEE.

Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration

ECTC 2010 Focus sur le soudage IMEC and the Katholieke Universiteit Leuven Télécharger

This material is posted here with permission of IEEE.

Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process

ECTC 2010 Focus sur le soudage Institute of Microelectronics - A*STAR Télécharger

This material is posted here with permission of IEEE.

Ultrathin 3D ACA FlipChip-In-Flex Technology

ECTC 2010 Focus sur le soudage Berlin Technical University, NB Technologies and Fraunhofer IZM Télécharger

This material is posted here with permission of IEEE.

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SPIE Defense, Sensing & Security 2010 Focus sur le soudage HRL Laboratories Télécharger

Copyright 2010 SPIE

SET Technical Bulletin N°3

February 2010 Focus sur le soudage CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc... Télécharger

Embedded active device packaging technology for real DDR2 memory chips

IWLPC 2010 Focus sur le soudage Industrial Technology Research Institute (ITRI) Télécharger

Originally published in the IWLPC Proceedings

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

IMAPS 2010 Focus sur le soudage RTI International Télécharger

This material is posted here with permission of Imaps.

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

Device Packaging 2009 Focus sur le soudage CEA-LETI Télécharger

This material is posted here with permission of Imaps.

RF MEMS and flip-chip for space flight demonstrator

June 2009 Focus sur le soudage Thales Alenia Space Télécharger

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array

ECTC 2008 Focus sur le soudage CEA-LETI Télécharger

This material is posted here with permission of IEEE.

NaPANIL « Library of Processes »

March 2012 Focus sur la nanoimpression NaPANIL Télécharger

Second edition with results of the NaPANIL-project

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization

February 2008 Focus sur la nanoimpression CNR-IMM Télécharger

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

November 2008 Focus sur la nanoimpression IISB Télécharger

Toward a flip-chip bonder dedicated to direct bonding for production environment

Publications aux Conférences Télécharger

Pascal Metzger from SET at IWLPC – San Jose, CA, USA, October 24-25, 2017  

Development done on Device Bonder to Address 3D Requirements in a Production Environment

Publications aux Conférences Télécharger

Pascal Metzger from SET at IWLPC, San Jose, November 11-13, 2014

Opto-electronics flip-chip bonding automation and in-situ quality monitoring

Publications aux Conférences Télécharger

Aurélien Griffart from SET at EMPC – Pisa, Italy, September 16-19, 2019  

Flip-chip bonding: how to meet the high accuracy requirements ?

Publications aux Conférences Télécharger

Caroline Avrillier from SET at EMPC – Warsaw, Poland, September 10-13, 2017  

Chip-to-Wafer Technologies for High Density 3D Integration

Publications aux Conférences Télécharger

Penned by CEA Leti, Minatec campus, CNRS Cemes, ALES, SET, ST Microelectronics and presented at MinaPad 2011

Flip-Chip Assembly FPA

Publications aux Conférences Télécharger

Jean-Stéphane Mottet from SET at ORION – Moscow XXII International Conference Photoelectronics and Night Vision Devices, May 28th, 2014

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

Publications aux Conférences Télécharger

Gilbert Lecarpentier from SET at Imaps Device Packaging 2011

Flip-chip die bonding: an enabling technology for 3D integration

Publications aux Conférences

Keith Cooper from SET North America at IWLPC 2010

Flip-chip assembly for focal plane array

Publications aux Conférences Télécharger

Pascal Metzger from SET at IST :GST – Mumbai, India, November 25-26, 2017  

Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding

Publications aux Conférences Télécharger

Gilbert Lecarpentier from SET at Imaps Device Packaging 2010

Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die

Publications aux Conférences Télécharger

Gilbert Lecarpentier from SET at Imaps Device Packaging 2012

High Accuracy Flip-Chip Equipement

Publications aux Conférences Télécharger

Nicolas Raynaud from SET at European 3D Summit – Grenoble, France, 18-20 January 2016

Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme

Publications aux Conférences Télécharger

Keith Cooper from SET North America at IWLPC 2011