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Quantum Computing
November 30th, 2017 Focus on bonding Download
Qubit compatible superconducting interconnects
Toward a Flip-Chip Bonder dedicated to Direct Bonding for Production Environment
IWLPC 2017 Focus on bonding SET, Saint-Jeoire, France Download
3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.
Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype
June 30, 2016 Focus on bonding DPNC, University of Geneva, Switzerland Download
Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch
ECTC 2015 Focus on bonding IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Download
Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors
7-12 September, 2014 Focus on bonding UNIVERSITY OF SURREY, Guilford, Surrey, U.K. 10th International Conference on Position Sensitive Detectors Download
Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond
EPTC 2014 Focus on bonding IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Singapore Download
Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application
June 2014 Focus on bonding IME - Journal of Electronics materials (abstract) Download
Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications
June 2014 Focus on bonding RTI International Download
High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch
June 2014 Focus on bonding RTI International Download
Chip to wafer copper direct bonding electrical characterization and thermal cycling
December 2013 Focus on bonding CEA – LETI, MINATEC Campus Download
Micro-tube insertion into aluminum pads: Simulation and experimental validations
IMAPS 2013 Focus on bonding CEA – LETI, MINATEC Campus Download
9th International Conference and Exhibition on Device Packaging
This material is posted here with permission of IMAPS.
Aluminum to aluminum Bonding at Room Temperature
ECTC 2013 Focus on bonding CEA – LETI, MINATEC Campus Download
Chip to wafer direct bonding technologies for high density 3D integration
ECTC 2012 Focus on bonding CEA – LETI, MINATEC, STMicroelectronics, SET Download
A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications
ECTC 2011 Focus on bonding CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M Download
This material is posted here with permission of IEEE.
Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly
ECTC 2011 Focus on bonding IBM T.J. Watson Research Center Download
This material is posted here with permission of IEEE.
Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration
ECTC 2010 Focus on bonding IMEC and the Katholieke Universiteit Leuven Download
This material is posted here with permission of IEEE.
Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process
ECTC 2010 Focus on bonding Institute of Microelectronics - A*STAR Download
This material is posted here with permission of IEEE.
Ultrathin 3D ACA FlipChip-In-Flex Technology
ECTC 2010 Focus on bonding Berlin Technical University, NB Technologies and Fraunhofer IZM Download
This material is posted here with permission of IEEE.
Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors
SPIE Defense, Sensing & Security 2010 Focus on bonding HRL Laboratories Download
Copyright 2010 SPIE
SET Technical Bulletin N°3
February 2010 Focus on bonding CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc... Download
Embedded active device packaging technology for real DDR2 memory chips
IWLPC 2010 Focus on bonding Industrial Technology Research Institute (ITRI) Download
Originally published in the IWLPC Proceedings
Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration
IMAPS 2010 Focus on bonding RTI International Download
This material is posted here with permission of Imaps.
Development done on Device Bonder to address 3D requirements in a Production Environment
Focus on bonding Download
IWLPC 2014 focus on bonding SET, Saint-Jeoire, France
Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes
Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections
Device Packaging 2009 Focus on bonding CEA-LETI Download
This material is posted here with permission of Imaps.
RF MEMS and flip-chip for space flight demonstrator
June 2009 Focus on bonding Thales Alenia Space Download
New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array
ECTC 2008 Focus on bonding CEA-LETI Download
This material is posted here with permission of IEEE.
NaPANIL “Library of Processes”
March 2012 Focus on nanoimprinting NaPANIL Download
Second edition with results of the NaPANIL-project
UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale
November 2008 Focus on nanoimprinting IISB Download
UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization
February 2008 Focus on nanoimprinting CNR-IMM Download
Die to wafer hybrid bonding equipment: throughput versus precision
MiNaPAD 2022 Conference proceeding SET, CEA Leti Download
Towards 5μm Interconnection Pitch with Die-to-Wafer Direct Hybrid Bonding
ECTC 2021 Conference proceeding CEA Leti, SET Download
Die-to-Wafer Direct Hybrid Bonding demonstration with High Alignment Accuracy and Electrical Yields
3DIC 2019 Conference proceeding CEA Leti, SET Download
Opto-electronics flip-chip bonding automation and in-situ quality monitoring
EMPC 2019 Conference proceeding A. Griffart Download
Die-to-Wafer Direct Bonding for Production Environment with a New Flip-Chip Bonder
MiNaPAD 2019 Conference proceeding P. Metzger, N. Raynaud Download
New Flip-Chip Bonder dedicated to Direct Bonding for Production Environment
ESTC 2018 Conference proceeding SET, CEA Leti Download
Flip-chip bonding: how to meet the high accuracy requirements ?
EMPC 2017 Conference proceeding C. Avrillier Download
Flip-chip assembly for focal plane array
IST:GST Mumbai 2017 Conference proceeding P. Metzger Download
Toward a flip-chip bonder dedicated to direct bonding for production environment
IWLPC 2017 Conference proceeding P. Metzger Download
Considerations on the design of high precision Flip-Chip Bonder for mass production
European 3D Summit 2016 Conference proceeding N. Raynaud Download
Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding
IMAPS Device Packaging Conference 2010 Conference proceeding G. Lecarpentier Download
Flip-chip die bonding: an enabling technology for 3D integration
IWLPC 2010 Conference proceeding K. Cooper from SET North America Download
Development done on Device Bonder to Address 3D Requirements in a Production Environment
IWLPC 2014 Conference proceeding P. Metzger Download
Flip-Chip Assembly for Focal Plane Array
ORION - Moscow International Conference Photoelectronics and Night Vision Devices 2014 Conference proceeding J.-S. Mottet Download
Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die
IMAPS Device Packaging Conference 2012 Conference proceeding G. Lecarpentier Download
3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction
IMAPS Device Packaging Conference 2011 Conference proceeding G. Lecarpentier Download
Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme
IWLPC 2011 Conference proceeding K. Cooper from SET North America Download
Chip-to-Wafer Technologies for High Density 3D Integration
MiNaPAD 2011 Conference proceeding CEA Leti, Minatec campus, CNRS Cemes, ALES, SET, ST Microelectronics Download