The OntosTT, proposed in 2 versions – 200 mm and 300 mm , is a table-top semi-automatic Atmospheric Plasma System for surface preparation.
2 sizes of Plasma head are available – 25 mm and 40 mm.
It provides a simple, effective, clean surface modification method which does not require the throughput-robbing vacuum chamber associated with traditional plasma systems.
It performs this surface modification without ion bombardment and without the cross-contamination issues often associated with conventional plasma systems.
Click here to request the OntosTT Datasheet.
The OEM version of the Ontos Plasma Head is available for integration into third party equipment.
3 sizes of Plasma head are available – 10 mm, 25 mm and 40 mm.
The OntosIS system is available on our FC300 Flip-Chip Bonder.
Surface preparation for bonding
Photoresist residue removal
Native oxide removal from semiconductor surfaces
Organic contamination removal prior to adhesive bonding
Pre-plating surface preparation