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High Force Bonding
Concept
For certain devices, e.g., very large devices containing several millions of connections such as bumps, a very high force is required to obtain sufficient pressure per bump and achieve a suitable, reliable, efficient electrical and mechanical connection. A two-step assembly process is required.
Process
The first bonding, which occurs right after achieving a precise alignment between substrate and chip, is accomplished at high force on a Flip-Chip Bonder.
Afterwards, the assembled components are transferred to the LDP150, where they are installed and secured on a chuck. The bonding process is then continued at room temperature at very high force, according to specific cycles and without losing the initial post-bond accuracy and parallelism. Forces as high as 100,000 N are available.