agencesiteo

SET winner of the MICRON D’OR (‘GOLDEN MICRON’)

SET is proud to announce a new and important partnership!

MINALOGIC

Chip­-to­-Wafer Direct ­Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder

SET Introduces FC300R High Accuracy Device Bonder with Robotics

SET introduces Innovative Patented Chamber for Removal of Oxide

SET receives strategic wafer level packaging equipment order from SEMATECH at UAlbany NanoCollege

SET to collaborate with IMEC on 3D integration research

SET receives the Georg-Waeber-Prize for Innovation 2008

Cambridge University selects S.E.T. KADETT for LCoS applications