Image Sensors & Pixelized Detectors

FPA & IR, UV, X-Ray Sensors

Opto-electronics and Silicon Photonics

µLEDs Displays
Laser Bars
Optical Components
Photonics Packaging

2,5-3D Integration and Micro-Assembly

3D Interconnect
RF Applications
MEMS Packaging
MCM & LCD

And also…

Hot Embossing Lithography
UV-NIL
Direct Bonding
High Pressure Bonding

SUCCESS STORY

Find out why the world-renowned TECHNISCHE UNIVERSITÄT ILLMENAU (Germany) chose SET Flip-Chip Bonder ACCµRA100 for its research projects.

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