SUCCESS STORY

Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration

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Image Sensors & Pixelized Detectors

FPA & IR, UV, X-Ray Sensors

Opto-electronics and Silicon Photonics

µLEDs Displays
Laser Bars
Optical Components
Photonics Packaging

2,5-3D Integration and Micro-Assembly

3D Interconnect
RF Applications
MEMS Packaging
MCM & LCD

And also…

Hot Embossing Lithography
UV-NIL
Direct Bonding
High Pressure Bonding