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FC300
The FC300 Flip-Chip Bonder is a next-generation high accuracy, high force system for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications, with ± 0.3 µm post-bond accuracy.
The FC300 covers a broad range of bonding forces, from 1 to 4000 N, making it optimal for reflow and thermocompression processes.
Before each bonding, the leveling between both components is adjusted within 1 μradian.
The parallelism adjustment, high-resolution alignment, and perfect control of all bonding parameters allow for achieving submicronic post-bond accuracy.
FC300
Key benefits
- ± 0.3 µm post-bond accuracy
- Low / High bonding forces
- Perfect parallelism control
- Confining gas, including formic acid
- Unique vision system
- From R&D to pilot line
Process capabilities
- Flip-Chip / Die bonding
- Thermocompression
- Reflow
- Adhesive bonding
- UV-curing bonding
- Thermosonic
Applications
- Infrared and X-Ray image sensors
- MicroLEDs displays
- Quantum computing
- 3D integration, memory stacking
- Optoelectronics
- Silicon photonics
- Chip-to-Chip
- Chip-to-Wafer
- Nanoimprinting
Technical data
Click here to request the FC300 datasheet.