A broad product portfolio covering a wide variety of applications

Since the delivery of the first SET Flip-Chip Bonder in 1981, we have continuously honed our expertise in high-accuracy alignment, placement, and bonding.

Today, SET Flip-Chip Bonders realize myriad solutions. Low or high force assembly, room or high-temperature bonding, thermal or UV gluing, and hybridization of small / large / thin / thick components are all achievable, reaching submicron post-bond accuracy with real-time control of the process parameters.