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While radio frequency devices have typically not required high-accuracy bonding, some recent applications have confirmed the need for finer control of the bonding process.

For certain RF applications, e.g., advanced satellite systems, highly accurate alignment (within 1 µm between chip and substrate) has become desirable. The typical gold-to-gold bonding technique used for RF devices requires inordinately high force at high temperature, a combination that doesn’t lend itself to high accuracy.

On the other hand, SET Flip-Chip Bonders can handle brittle materials safely and easily, even at elevated temperature and high force. Moreover, improved control of the force profile throughout the cycle results in better bonding accuracy. By leveraging high-performance thermocompression and leveling capability, SET has made high-end RF connections a reality, with accuracy levels that set a new standard for RF applications.