Success in the assembly of photonic devices (e.g., laser diode, optical bench, optical fiber, lenses, prisms) requires skilled handling, alignment, and post-bonding accuracy, without scratching any active surfaces.

Any scratch or blemish on an active optical surface would significantly compromise the module’s optical emission, reflection, and transmission.

One of the main assets of SET Flip-Chip Bonders is their ability to safely manipulate such components.