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The ability to integrate mechanical elements with supporting electronics on a micro scale has bolstered Micro ElectroMechanical Systems (MEMS) and Micro OptoElectroMechanical Systems (MOEMS), as enabling technologies, sparking interest in an impressive range of applications.

Subcomponents can be constructed independently through a combination of traditional processes and novel technologies. However, this approach presents several challenges for the handling, maneuvering, aligning and attaching of each component.

SET Flip-Chip Bonders demonstrate superior ability in handling delicate pieces (down to 200 microns) and aligning them better than ± 1 µm – for example, an adaptive optics system or a high-end inkjet printhead.