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ACCµRA M
The ACCμRA M is a manual Flip-Chip Bonder that can reach ± 3 μm post-bond accuracy.
The only motorized axis is the arm, which precisely controls the bonding force.
Combining and synchronizing the arm with the temperature controller guarantees perfect quality and high repeatability of a process.
More than just a pick-and-place system, the ACCμRA M also offers thermocompression and reflow capabilities.
Perfect for universities and R&D institutes.
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Key benefits
- ± 3 μm post-bond accuracy
- Small footprint
- Manual machine
- Easy to use
- Open platform
- R&D oriented
Process capabilities
- Thermocompression
- Reflow
- UV Curing
- Au, Au/Sn, In, Cu
Applications
- Flip-Chip, Die Attach
- C2C, C2S, C2W
- Optoelectronics
- Micro-Assembly
- MEMS, MOEMS, MCM
Technical data
Click here to request the ACCµRA M datasheet.