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ACCµRA Plus
The ACCμRA Plus is a Flip-Chip Bonder that can reach ± 0.5 μm @ 3 σ post-bond accuracy in fully automatic mode.
Suitable for reflow and thermocompression processes.
The ACCμRA Plus combines high precision, flexibility, and short cycle time.
Dedicated to production in optoelectronics and silicon photonics applications.
ACCµRA Plus
Key benefits
- ± 0.5 μm @ 3 σ post-bond accuracy
- High accuracy and high throughput
- Fully automatic
- High flexibility and reliability
- Ultra-small dies
Process capabilities
- Flip-chip bonding
- Die bonding
- Thermocompression
- Refusion
- Polymérisation UV
- Au, Au/Sn, In, Cu
- Pick & Place
Applications
- Laser diodes, laser bars
- VECSEL, photo diode
- LED
- Prisms, lenses, mirrors
- Micro assembly
- Flip-chip bonding, die bonding
- Chip-to-chip, chip-to-substrate
Technical data
Click here to request the ACCµRA Plus datasheet.