The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bonding accuracy. Its flexibility makes it ideal for developing a wide range of applications. The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

It is the perfect equipment for universities and R&D institutes.



Key benefits

  • Small footprint
  • Easy to use
  • Quick Set-Up
  • R&D oriented
  • High Force

Process capabilities

  • Thermocompression
  • Reflow
  • UV Curing
  • Au, Au/Sn, In, Cu, Cu/Sn
  • Adhesives
  • Thermosonic


Technical data

Click here to request the ACCµRA100 datasheet.