The ACCµRA100 is a Flip-Chip Bonder that permits to reach ± 0.5 µm post-bond accuracy.
Its flexibility makes it ideal for developing a wide range of applications.
The ACCµRA100 combines high precision, accessibility and cost-effectiveness.
It is the perfect equipment for universities and R&D institutes.
- ± 0.5 μm post-bond accuracy
- Small footprint
- Easy to use
- Quick set-up
- R&D oriented
- High force
- UV Curing
- Au, Au/Sn, In, Cu, Cu/Sn
Click here to request the ACCµRA100 datasheet.