The ACCµRA100 is a Flip-Chip Bonder that permits to reach ± 0.5 µm post-bond accuracy.

Its flexibility makes it ideal for developing a wide range of applications.
The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

It is the perfect equipment for universities and R&D institutes.



Key benefits

  • ± 0.5 μm post-bond accuracy
  • Small footprint
  • Easy to use
  • Quick set-up
  • R&D oriented
  • High force

Process capabilities

  • Thermocompression
  • Reflow
  • UV Curing
  • Au, Au/Sn, In, Cu, Cu/Sn
  • Adhesives
  • Thermosonic


Technical data

Click here to request the ACCµRA100 datasheet.