The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bonding accuracy.

Its flexibility makes it ideal for developing a wide range of applications.

The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

It is the perfect equipment for universities and R&D institutes.

Key Benefits

  • Small footprint
  • Easy to use
  • Quick Set-Up
  • R&D oriented
  • High Force

Technical Data

Click here to request the ACCµRA100 Datasheet.

Process Capabilities

  • Thermocompression
  • Reflow
  • UV Curing
  • Au, Au/Sn, In, Cu, Cu/Sn
  • Adhesives
  • Thermosonic