The ACCμRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode.
It is suitable for reflow and thermocompression processes.

The ACCμRA Plus combines high precision, flexibility and short cycle time.                                                                                                                                  

It is dedicated to production for optoelectronic and silicon photonics applications.


Cliquez here to request the ACCµRA Plus datasheet.


Key Benefits

  • High accuracy and high throughput
  • Full automatic
  • High flexibility and reliability
  • Ultra-small dies

Technical Data

Cliquez here to request the ACCµRA Plus datasheet.

Process capabilities

  • Flip-chip bonding
  • Die bonding
  • Thermocompression
  • Refusion
  • Polymérisation UV
  • Au, Au/Sn, In, Cu
  • Pick & Place


  • Laser diodes, laser bars
  • VECSEL, photo diode
  • LED
  • Prisms, lenses, mirrors
  • Micro assembly
  • Flip-chip bonding, die bonding
  • Chip-to-chip, chip-to-substrate