The ACCμRA Plus is a Flip-Chip Bonder that permits to reach ± 0.5 μm @ 3 σ post-bond accuracy in full automatic mode.

It is suitable for reflow and thermocompression processes.

The ACCμRA Plus combines high precision, flexibility and short cycle time.

It is dedicated to production for optoelectronics and silicon photonics applications.



Key benefits

  • ± 0.5 μm @ 3 σ post-bond accuracy
  • High accuracy and high throughput
  • Full automatic
  • High flexibility and reliability
  • Ultra-small dies

Process capabilities

  • Flip-chip bonding
  • Die bonding
  • Thermocompression
  • Refusion
  • Polymérisation UV
  • Au, Au/Sn, In, Cu
  • Pick & Place


  • Laser diodes, laser bars
  • VECSEL, photo diode
  • LED
  • Prisms, lenses, mirrors
  • Micro assembly
  • Flip-chip bonding, die bonding
  • Chip-to-chip, chip-to-substrate

Technical data

Click here to request the ACCµRA Plus datasheet.