The ACCμRA OPTO is a Flip-Chip Bonder that permits to reach ± 0.5 μm post-bond accuracy.
It is dedicated to low force and reflow processes.
Motorized axes guarantee a high repeatability of your process.
The ACCμRA OPTO combines high precision, flexibility and accessibility.
It is the perfect equipment for optoelectronics and silicon photonics applications.
- ± 0.5 μm post-bond accuracy
- Small footprint
- Easy to use
- Quick Set-Up
- R&D oriented
- Low Force
- UV Curing
- Au, Au/Sn, In, Cu, Cu/Sn
Click here to request the ACCµRA OPTO datasheet.