The ACCμRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy.

It is dedicated to low force and reflow processes.

Motorized axes guarantee a high repeatability of your process.

The ACCμRA OPTO combines high precision, flexibility and accessibility.

It is the perfect equipment for optoelectronics and silicon photonics applications.


Click here to request the ACCµRA OPTO Datasheet.


Key Benefits

  • Small footprint
  • Easy to use
  • Quick Set-Up
  • R&D oriented
  • Low Force

Process Capabilities

  • Thermocompression
  • Reflow
  • UV Curing
  • Au, Au/Sn, In, Cu, Cu/Sn