The ACCμRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy.
It is dedicated to low force and reflow processes.
Motorized axes guarantee a high repeatability of your process.
The ACCμRA OPTO combines high precision, flexibility and accessibility.
It is the perfect equipment for optoelectronics and silicon photonics applications.
- Small footprint
- Easy to use
- Quick Set-Up
- R&D oriented
- Low Force
Click here to request the ACCµRA OPTO Datasheet.
- UV Curing
- Au, Au/Sn, In, Cu, Cu/Sn