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ACCµRA M
The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy.
The only motorized axis is the arm, which controls precisely the bonding force.
Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.
It is the perfect equipment for universities and R&D institutes.
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Key benefits
- ± 3 μm post-bond accuracy
- Small footprint
- Manual machine
- Easy to use
- Open platform
- R&D oriented
Process capabilities
- Thermocompression
- Reflow
- UV Curing
- Au, Au/Sn, In, Cu
Applications
- Flip-Chip, Die Attach
- C2C, C2S, C2W
- Optoelectronics
- Micro-Assembly
- MEMS, MOEMS, MCM
Technical data
Click here to request the ACCµRA M datasheet.