One of the main challenges in the assembly of µLEDs lies in the handling, alignment, parallelism and post bonding accuracy of the components.
Thanks to its long and rich experience with FPA, SET offers its skill to customers involved in this promising displays and lighting devices using µLEDs.
Flip-chip bonding: how to meet the high accuracy requirements ?
Conference proceeding Download
Caroline Avrillier from SET at EMPC – Warsaw, Poland, September 10-13, 2017