SET launches the FC150 PLATINUM

Advanced R&D Flip-Chip Bonder

As SEMICON Europa 2022 kicks off in Munich, Germany, SET officially launches the FC150 PLATINUM for the telecom, quantum, automotive, defense, HPC, AI, VR markets. This new equipment is the latest version of the FC150, which is SET’s historic machine, present in laboratories all over the world.

Greatly improved accuracy

The FC150 PLATINUM includes all SET’s features and 40 years of know-how. The accuracy of the previous FC150 has been highly improved thanks to ± 0.1 µm alignment accuracy. And the parallelism between the two samples has been adjusted within few microradians.

Versatile Flip-Chip Bonder

The FC150 PLATINUM offers both manual (step by step) and automatic mode. It is designed for chip-to-chip (up to 100 mm) and chip-to-wafer (up to 200 mm) applications on the same open platform. Thanks to many features, it covers a large range of applications from low to high forces: 0.25-2000 N.