When assembling an optoelectronic device (e.g., laser diode, optical bench, optical fiber, micro bench, HDD/HAMR, laser bars, µLEDs), two main challenges are alignment and post-bonding accuracy.

In the field of high-speed telecommunication fiber-optic networks, transmission signal quality is critical to product performance. When aligning the laser to the optic fiber core, any differentiation greater than 1 µm results in unacceptable signal loss.

A submicronic post-bond accuracy, coupled with real-time low force control, is a real asset in achieving this highly demanding optical packaging.