Technical papers

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch

Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond

Flip-chip bonding: how to meet the high accuracy requirements ?

Flip-chip assembly for focal plane array

Considerations on the design of high precision Flip-Chip Bonder for mass production

NPS300 Nano Patterning Stepper

Chip to wafer copper direct bonding electrical characterization and thermal cycling