Technical papers

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SET Technical Bulletin N°3

Embedded active device packaging technology for real DDR2 memory chips

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding

Development done on Device Bonder to Address 3D Requirements in a Production Environment

Development done on Device Bonder to address 3D requirements in a Production Environment

Flip-Chip Assembly FPA

Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die