Schwerpunkt auf Bonden

Quantum Computing

Toward a Flip-Chip Bonder dedicated to Direct Bonding for Production Environment

Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype

Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch

Chip to wafer copper direct bonding electrical characterization and thermal cycling

Micro-tube insertion into aluminum pads: Simulation and experimental validations