Publications aux Conférences

Flip-chip die bonding: an enabling technology for 3D integration

Development done on Device Bonder to Address 3D Requirements in a Production Environment

Flip-Chip Assembly FPA

Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme

Chip-to-Wafer Technologies for High Density 3D Integration