Publications aux Conférences

Towards 5μm interconnection pitch with Die-to-Wafer direct hybrid bonding

Die to Wafer Direct Hybrid Bonding Demonstration with High Alignment Accuracy and Electrical Yields

Opto-electronics flip-chip bonding automation and in-situ quality monitoring

Die-to-Wafer Direct Bonding for Production Environment with a New Flip-Chip Bonder

New Flip-Chip Bonder dedicated to Direct Bonding for Production Environment

Flip-chip assembly for focal plane array

Toward a flip-chip bonder dedicated to direct bonding for production environment

Flip-chip bonding: how to meet the high accuracy requirements ?

Chip-to-Wafer Technologies for High Density 3D Integration

Flip-Chip Assembly FPA