Publications aux Conférences

Towards 5μm interconnection pitch with Die-to-Wafer direct hybrid bonding

Die to Wafer Direct Hybrid Bonding Demonstration with High Alignment Accuracy and Electrical Yields

Opto-electronics flip-chip bonding automation and in-situ quality monitoring

Die-to-Wafer Direct Bonding for Production Environment with a New Flip-Chip Bonder

New Flip-Chip Bonder dedicated to Direct Bonding for Production Environment

Toward a Flip-Chip Bonder dedicated to Direct Bonding for Production Environment

Flip-chip bonding: how to meet the high accuracy requirements ?

Flip-chip assembly for focal plane array

Considerations on the design of high precision Flip-Chip Bonder for mass production

Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding