Focus sur le soudage

Embedded active device packaging technology for real DDR2 memory chips

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

Development done on Device Bonder to address 3D requirements in a Production Environment

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

RF MEMS and flip-chip for space flight demonstrator

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array