Technical papers

Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme

Chip-to-Wafer Technologies for High Density 3D Integration

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

RF MEMS and flip-chip for space flight demonstrator

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array

Flip-chip die bonding: an enabling technology for 3D integration